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| product structure silicon integrated circuit this product has no designed protection against radioactive rays . 1/ 36 tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.co .jp 25.dec.2015 rev.002 gate driver providing galvanic isolation series isolation voltage 2500vrms 1ch gate driver providing galvanic i solation bm60054 fv - c general description the bm60054 fv - c is a gate driver with isolation voltage 2500vrms, i/o delay time of 110ns, and a mini mum input pulse width of 90ns . f ault signal output function, r eady signal output function, under voltage lockout (uvlo) function, short current protection (scp) function, and switching controller function are all built -in . feature s provid es galvanic isola tion fault s ignal o utput f unction ready s ignal o utput f unction under v oltage l ockout f unction short circuit p rotection f unction soft t urn - off f unction for short circuit p rotection (adjustable t urn - off time) thermal p rotection f unction active miller clampi ng switching c ontroller f unction output s tate f eedback f unction ul 1577 recognized :file no. e356010 aec - q100 qualified ( note 1 ) ( note 1 :grade1) application s driving igbt gate driving mosfet gate k ey specification s ? isolation voltage : 2500vrms ? maximum gate dr ive voltage : 20v(max) ? i/o delay time : 110ns(max) ? minimum input pulse width : 90ns(max) package w(typ) x d(typ) x h(max) ssop - b28w 9.2 mm x 10.4 mm x 2.4 mm typical application circuit figure 1. typical applica tion circuit datashee t
2 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 contents general description ................................ ................................ ................................ ................................ ................................ ...... 1 features ................................ ................................ ................................ ................................ ................................ ......................... 1 applications ................................ ................................ ................................ ................................ ................................ .................. 1 key specifications ................................ ................................ ................................ ................................ ................................ ........ 1 package w(typ) x d(typ) x h(max) ................................ ................................ ................................ ................................ ....... 1 typica l application circuit ................................ ................................ ................................ ................................ ........................... 1 contents ................................ ................................ ................................ ................................ ................................ ........................ 2 recommended range of external constant s3 pin configuration ................................ ................................ ................................ ................................ ................................ .......... 3 pin descrlptions ................................ ................................ ................................ ................................ ................................ ........... 3 absolute maximum ratings ................................ ................................ ................................ ................................ ......................... 4 recommended operating conditions ................................ ................................ ................................ ................................ ........ 4 insulation related characteristics ................................ ................................ ................................ ................................ .............. 4 electrical characteristics ................................ ................................ ................................ ................................ ............................. 5 electrical characteristics C continued ................................ ................................ ................................ ................................ ........ 6 typical performance curves ................................ ................................ ................................ ................................ ........................ 7 fig ure 3. main power supply circuit current 7 figure 4. output side circuit current (mode=h, vee2=0v, out1=l ) .7 fi gure 5. output side circuit current( mode=h, vee2=0v, out1=h) . 7 figu re 6. fet_g on - resistance(source side/sink side). .. 7 figure 7. oscillation frequency .... 8 figure 8. soft - start time . .... ... . 8 figure 9. fb pin thres hold voltage . ....8 figure 10. comp pin sink current ... .. .. 8 figure 11. comp pin source current ................................. .... . 9 figure 1 2 . over - curre nt detection threshold .. ... .. 9 figure 13. logic input filtering time (l pulse) ... . . . 9 figure 14. logic input filtering time (h pulse) . . 9 figure 15. ena input fil tering time ...... ................................. 10 figure 16. mode input voltage h/l . .. . 10 figure 17. out1h on - resistance (i out1 =40ma) . . . .. . 10 figure 18. out1l o n - resistance (i out1 =40ma) .. . 10 figure 19. proout on - resistan ce (i proout =40ma) 11 figure 20. turn on time..... ...11 figure 21. turn off time ..........1 1 figure 22. out2 on - resistance (i out2 =40ma) .. ... .1 1 figure 2 3 . short current detection threshold voltage .. ..12 figure 2 4 . desat leading edge blanking time .. ..12 figure 2 5 . short current detection filter time .. . . . .12 figure 2 6 . short current detection delay time . . .. .1 2 figure 2 7 . scpin low voltage . .. . ... 13 figure 2 8 . output delay difference between proout and flt . . ... . .1 3 figure 29 . thermal detection voltage .. ... ..1 3 application information ................................ ................................ ................................ ................................ .............................. 15 description of functions and examples of constant setting .. .. 16 selection of components externally connected ................................ ................................ ................................ ..................... 27 power dissipation ................................ ................................ ................................ ................................ ................................ ....... 27 thermal design ................................ ................................ ................................ ................................ ................................ ........... 27 i/o equivalence circuits ................................ ................................ ................................ ................................ ............................. 28 oper ational notes ... 32 o rdering in formation 3 3 marking diagram. 3 3 physical dimension, tape and reel information ................................ ................................ ................................ ..................... 34 revision history ................................ ................................ ................................ ................................ ................................ ......... 35 3 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 recommended range of external constan t s pin con f iguration pin descrlptions pin name symbol recommended value unit min typ max vreg c vreg 1.0 3.3 10.0 f vcc2 c vcc2 0.33 - - f rt r rt 24 68 150 k pin name pin function 1 vee2 output - side negative power supply pin 2 proout soft turn - off pin / gate voltage input pin 3 vtsin thermal detection pin 4 scpin short circuit current d et ection pin 5 nc no connect ion 6 gnd2 output - side ground pin 7 mode mode selection pin of output - side uvlo 8 uvloin output - side uvlo setting pin 9 vcc2 output - side positive power supply pin 10 nc no connection 11 out1h source side output pin 12 out1 l sink side output pin 13 out2 output pin for miller clamp 14 vee2 output - side negative power supply pin 15 gnd1 input - side ground pin 16 flt fault output pin 17 ena input enabling signal pin 18 ina control input pin a 19 inb control input pin b 20 rdy ready output pin 21 rt switching frequency setting pin for switching controller 22 fb error amplifier inverting input pin for switching controller 23 comp error amplifier output pin for switching controller 24 v_batt main power supply pin 25 vreg input - side internal power supply pin 26 fet_g mos fet control pin for switching controller 27 sense current detection pin fo r switching controller 28 gnd1 input - side ground pin (top view) 8 gnd1 28 8 sense 27 8 fet_g 26 8 vreg 25 8 v_batt 24 8 comp 23 8 fb 22 8 rt 8 rdy 20 8 inb 19 9 21 8 ina 18 8 ena 17 8 flt 16 8 gnd1 15 vee2 1 proout 2 vtsin 3 scpin 4 nc 5 gnd2 6 mode 7 uvloin 8 vcc2 9 nc 1 0 out1h 1 1 1 out1l 1 2 out2 1 3 vee2 1 4 4 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 ab solute maximum rating s ( note 2 ) relative to gnd1 ( note 3 ) relative to gnd2 ( note 4 ) should not exceed pd and tj=150 ? c ( note 5 ) derate above ta=25 ? c at a rate of 9.5mw/ ? c. mounted on a glass epoxy of 70 mm ? 70 mm ? 1.6 mm caut ion: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating condition s parameter symbol min max unit main power supply voltage ( note 6 ) v batt 4.0 32 v output - side positive supply voltage ( note 7 ) v cc2 1 0 20 v output - side negative supply voltage ( note 7 ) v ee2 - 12 0 v maximum difference between output - side positive and negative voltages v max2 10 28 v switching frequency for switching controller f swr 100 500 khz ( note 6 ) relative to gnd1 ( note 7 ) relativ e to gnd2 insulation related characteristic s (ul1577) parameter symbol characteristic unit insulation resistance (v io =500v) r s >10 9 insulation withstand voltage / 1min v iso 2500 vrms insulation test voltage / 1sec v iso 3000 vrms parameter symbol limit unit main power supply voltage v batt - 0.3 to +40.0 ( note 2 ) v output - side positive supply voltage v cc2 - 0.3 to +24.0 ( note 3 ) v output - side negative supply voltage v ee2 - 15.0 to +0.3 ( note 3 ) v maximum difference between output - side positive and n egative v oltages v max2 30.0 v ina, inb, ena pin input voltage v in - 0.3 to +7.0 ( note 2 ) v mode pin input voltage v mode - 0.3 to +vcc2+0.3 or + 24 .0 ( note 3 ) v scpin pin input voltage v scpin - 0.3 to +vcc2+0.3 or + 24 .0 ( note 3 ) v vtsin pin input voltage v vts - 0.3 to +vcc2+0.3 or + 24 .0 ( note 3 ) v uvloin pin input voltage v uvloin - 0.3 to +vcc2+0.3 or + 24 .0 ( note 3 ) v out1h, out1l pin output current (peak 10 out1peak 5.0 ( note 4 ) a out2 pin output current (peak 10 out2peak 5.0 ( note 4 ) a proout pin output current (peak 10 prooutpea k 2.5 ( note 4 ) a flt, rdy pin output c urrent i flt 10 ma fet_g pin output current (peak 1 fet_gpeak 1 a power dissipation pd 1.12 ( note 5 ) w operating temperature range t opr - 40 to +125 c storage temperature range t stg - 55 to +150 c junction temperature tjmax +150 c 5 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 electrical chara cteristic s ( unless otherwise specified t a = - 40 c to + 125 c , v batt =4.0v to 32v, v cc2 =uvlo to 20v, v ee2 = - 12v to 0v ) parameter symbol min typ max unit conditions general main power supply circuit current 1 i batt1 1 . 1 1 .6 2 . 1 ma v_batt=4.0v main power suppl y circuit current 2 i batt2 0.8 1.3 1.8 ma v_batt=12.0v main power supply circuit current 3 i batt3 0 . 8 1. 3 1 . 8 ma v_batt=32.0v output side circuit current 1 i cc21 0.7 1.4 2.1 ma v cc2 =14v, out1=l output side circuit current 2 i cc22 0.4 1.1 1.8 ma v cc2 =14v , out1=h output side circuit current 3 i cc23 0.8 1.5 2.2 ma v cc2 =18v, out1=l output side circuit current 4 i cc24 0.8 1.2 1.9 ma v cc2 =18v, out1=h output side circuit current 5 i cc25 0.9 1.6 2.3 ma v cc2 =16v, v ee2 = - 8v, out1=l output side circuit current 6 i cc26 0.6 1.3 2.0 ma v cc2 =16v, v ee2 = - 8v, out1=h switching power supply controller fet_g output voltage h1 v fetgh1 3.8 4.0 4.2 v 4.2v 7 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 ul1577 ratings table following values are described in ul report. para meter values units conditions side 1 (input side) circuit current 1.3 ma v_batt=1 2 v, out 1h/l =l side 2 (output side) circuit current 1.6 ma vcc2= 18v, vee2= - 6v, out 1h/l =l side 1 (input side) consumption power 15.6 mw v_batt=1 2 v, out 1h/l =l side 2 (output side) consumption power 38.4 mw vcc2= 18v, vee2= - 6v, out 1h/l =l isolation voltage 2500 vrms maximum operating (ambient) temperature 125 8 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 t ypical performance curves figure 3. main power supply circuit cur rent - 40 c 25 c 125 c figure 6. fet_g on - resistance (source side/sink side) figure 4. output side circuit current (mode =h, vee2=0v, out1=l) figure 5. output side circuit current ( mode=h, vee2=0v, out1=h) - 40 c 25 c 125 c - 40 c 25 c 125 c source side sink side 0.8 1 1.2 1.4 1.6 1.8 2 4 11 18 25 32 v batt [v] i batt [ma] 0 3 6 9 12 -40 0 40 80 120 ta [c] r ongh /rongl[] 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 10 15 20 v cc2 [v] i cc2 [ma] 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 10 15 20 v cc2 [v] i cc2 [ma] 9 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 figure 10. comp pin sink current figure 7. oscillation frequency figure 9. fb pin threshold voltage figure 8. soft - start time 100 200 300 400 500 0 20 40 60 80 100 120 140 r rt [k] f sw [khz] -160 -140 -120 -100 -80 -60 -40 -40 0 40 80 120 ta [c] i compsink [a] 0 10 20 30 40 50 -40 0 40 80 120 ta [c] t ss [ms] 1.47 1.48 1.49 1.5 1.51 1.52 1.53 -40 0 40 80 120 ta [c] v fb [v] 10 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 figure 11. comp pin source current figure 13. logic input filtering time (l pulse) figure 14. logic input filtering time (h pulse) figure 12. over - current detection threshold 0 25 50 75 4 11 18 25 32 ta [c] t infil [ns] 0 25 50 75 -40 0 40 80 120 ta [c] t infil [ns] 40 60 80 100 120 140 160 -40 0 40 80 120 ta [c] i compsource [a] 0.17 0.19 0.21 0.23 -40 0 40 80 120 ta [c] vocth[v] 11 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 figure 15. ena input filtering time figure 17. out1h on - resistance (i out1 =40ma) fi gure 18. out1l on - resistance (i out1 =40ma) figure 16. mode input voltage h/l v modeh v model 0 0.2 0.4 0.6 0.8 1 1.2 -40 0 40 80 120 ta [ ] r onh [] 0 0.2 0.4 0.6 0.8 1 1.2 -40 0 40 80 120 ta [ ] r onl [] 8 8.2 8.4 8.6 8.8 9 -40 0 40 80 120 ta [ ] v modeh/l [v] 0 0.2 0.4 0.6 0.8 1 -40 0 40 80 120 ta [ ] t enafil [s] 12 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 figure 20. turn on time figure 21. turn off time figure 19. proout on - resistance (i proout =40ma) figure 22. out2 on - resistance (i out2 =40ma) 40 60 80 100 -40 0 40 80 120 ta [ ] t pona [ns] 0.45 0.65 0.85 1.05 1.25 1.45 -40 0 40 80 120 ta [ ] r onpro [] 45 65 85 105 -40 0 40 80 120 ta [ ] t pona [ns] 0.25 0.45 0.65 -40 0 40 80 120 ta [c] r onpro [ ] 13 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 figure 25. short current detection filter time figure 24. desat leading edge blanking time figure 23. short current detection voltage figure 26. short current detection delay time 0.26 0.32 0.38 0.44 0.5 -40 0 40 80 120 ta [c] t scppro [s] 0.14 0.16 0.18 0.2 0.22 0.24 0.26 -40 0 40 80 120 ta [c] t desatleb [s] 0.12 0.16 0.2 0.24 0.28 -40 0 40 80 120 ta [c] t scpfil [ns] 0.47 0.48 0.49 0.5 0.51 0.52 0.53 -40 0 40 80 120 ta [c] v scdet [v] 14 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 figure 29. thermal detection voltage figure 28. output delay differenc e between proout and flt figure 27. scpin pin low voltage 1.61 1.65 1.69 1.73 1.77 -40 0 40 80 120 ta [c] v tsdet [v] 0.1 0.3 0.5 0.7 -40 0 40 80 120 ta [c] t proflt [s] 0 0.05 0.1 0.15 0.2 -40 0 40 80 120 ta [c] v scpinl [v] 15 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 application informatio n 1. description of pins and cautions on layout of board (1) v_batt (main power supply pin ) this is the main power supply pin. connect a bypass capacitor betw een v_batt and gnd1 in order to suppress voltage variation s . (2) gnd1 (input - side ground pin ) the gnd1 pin is a ground pin on the input side. (3) vcc2 (output - side positive power supply pin ) the vcc2 pin is a positive power supply pin on the output side. to red uce voltage fluctuations due to out1h/l pin output current and due to the driv ing current of the internal transformers, connect a bypass capacitor between vcc2 and gnd2 pins. (4) vee2 (output - side negative power supply pin ) the vee2 pin is a power supply pin on the output side. to suppress voltage fluctuations due to out1h/l pin output current and due to the driv ing current of the internal transformers , connect a bypass capacitor between the vee2 and the gnd2 pins. c onnect the vee2 pin to the gnd2 pin when no negative power supply is used , (5) gnd2 (output - side ground pin ) the gnd2 pin is a ground pin on the output side. connect th e gnd2 pin to the emitter / source of a power device . (6) ina,inb,ena (control input terminal ) the ina,inb,ena are pin s used to determine output logic. ena inb ina out1h out1l l x x hi - z l h h x hi - z l h l l hi - z l h l h h hi - z fault state(flt=l output) is released in rising of ena(l h). (7) flt (fault output pin) the flt pin is an open drain pin used to output a fault signal when short circuit protection function (scp) or thermal protection function is activated, and wil l be cleared at the rising edge of ena . status flt while in normal operation hi - z when a f ault occurs (when scp or thermal protection is activated) l (8) rdy (ready output pin ) the rdy pin shows the status of three internal protection features which are v_ batt uvlo, vcc2 uvlo, and output state feedback (osfb). the term output state feedback shows whether proout pin voltage (high or low) corresponds to input logic or not. status rdy while in normal operation hi - z v_batt uvlo or vcc2 uvlo or output state feedback l (9) mode (mode selection pin of output - side uvlo) the mode pin is a pin which select s internal threshold or external setting threshold for output - side uvlo. mode output - side uvlo threshold voltage l (=gnd2) setting by external. (use uvloin pin) h (=vcc2) fixed (= v uvlo2l ). (connect uvloin pin to vcc2 pin) (10) uvloin (output - side uvlo setting input pin ) the uvloin pin is a pin for deciding uvlo setting value of vcc2. the threshold value of uvlo can be set by dividing the resistance voltage of vcc2 an d inputting such value. uvloin activate s only at mode pin=l. when mode pin=h, connect uvloin pin to vcc2 pin. (11) out1h, out1l(output pin ) the out1h pin is a source side pin used to drive the gate of a power device, and the out1l pin is a sink side pin used t o drive the gate of a power device. 16 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 (12) out2 (miller clamp pin ) this is the miller clamp pin for preventing a rise of gate voltage due to miller current of output element connected to out1. it also functions as a pin for monitoring gate voltage for mille r clamp and out2 pin voltage become not more than vout2on(typ 2.0v), miller clamp function operates. out2 should be connect to vee2 when miller clamp function is not used. (13) proout (soft turn - off pin ) this is a pin for soft turn - off of output pin when short - circuit protection is in action. it also functions as a pin for monitoring gate voltage for output state feedback function. (14) scpin ( short circuit current detection pin ) the scpin pin is a pin used to detect current for short circuit protection . when the sc pin pin voltage exceeds v scdet ,scp function will be activated. this may cause the ic to malfunction in an open state. to avoid such trouble, short - circuit the scpin pin to the gnd2 pin when the short circuit protection is not used. in order to prevent the wrong detection due to noise, the noise filter time t scpfil is set . (15) vtsin (thermal detection pin ) the vtsin pin is a temperature sensor voltage input pin, which can be used for thermal protection of an output device. if vtsin pin voltage becomes v tsdet or less, out1h/l pin is set to hiz/l. ic may malfunction i n the open status , so be sure to supply the vtspin more than v tsdet if the thermal protection function is not used. in order to prevent the wrong detection due to noise, the noise mask time t tsmsk is set. in addition, it can be used also as compulsi ve shutdown terminal other than a temperature sense by input ting a comparator output etc . (16) rt (switching frequency setting pin for switching controller ) the rt pin is a pin used to make setting of switching frequency of switching controller. the switching frequency is determined by the resistance value connected between rt and gnd1. the value of switching frequency is determined by the value of the resist o r r rt. (17) fb (error amplifier inverting input pin for switching controller ) this is a voltage feedback pin of the switching controller. this pin combine with voltage monitoring at overvoltage protection function and under voltage protection function for switching controller. when over voltage or under voltage protection is activated, switching controller will be at off state (fet_g pin outputs low). when the protection holding time (t dcdcrls ) is completed, the protection function will be released. under voltage function is not activated during soft - start. (18) comp (error amplifier output pin for switching controller ) this is the gain control pin of the switching controller. connect a phase compensation capacitor and resist or . (19) vreg ( input - side internal power supply pin ) this is the input - si de internal power supply pin . b e sure to connect a capacitor between vreg and gnd1 even when the switching controller is not used, in order to prevent oscillation and suppress voltage variation due to fet_g output current. (20) fet_g (mos fet control pin for s witching controller ) this is a mosfet control pin for the switching controller transformer drive. (21) sense ( connection to the current feedback resistor of the switching controller ) this is a pin connected to the resist or of the switching controller current f eedback. this pin combine s with current monitoring at overcurrent protection function for switching controller. when overcurrent protection is activated, switching controller will be at off state (fet_g pin outputs low). when the protection holding time (t dcdcrls ) is completed, the over - current function will be released. ? ? ) . r . /( khz f rt sw 4 8 10 2 2 10 3 7 1 ? ? ? ? ? ? ? 17/ 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 2. description of functions and examples of constant setting (1) miller clamp function when out1=l and out 2 pin voltage < v out2on , internal mos of out2 pin is turned on and miller clamp functi on operates. in out2 pin input voltage out2 l not more than v out2on l h x hi-z fig ure 30. block diagram of miller clamp function figure 3 1 . timing chart of miller clamp function h l h l v ts det v sc det h i - z l h h i - z l v out2on out2 out1h/l flt scpin ina vtsin t pon t sto e na t sto v out2on out2 logic out1h/l vcc2 proout vee 2 - + predriver predriver predriver predriver gnd2 18 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 (2) under voltage lockout ( uvlo ) function the bm60054 fv - c incorporates the under voltage lockout (uvlo) function on v_batt and vc c2. when the power supply voltage drops to the uvlo on voltage, the out1h/l pin will output the "hi - z / l" and the flt pin will output the l signal. when the power supply voltage rises to the uvlo off voltage, these pins will be reset. in addition, to pr event m is - triggers due to noise, mask time t uvlobattfil and t uvlo2fil are set on both voltage sides. figure 34. vcc2 uvlo function operation timing chart (mode=h) figure 33. vcc2 uvlo function operation timing char t (mode=l) figure 32. vbatt uvlo function operation timing chart ina h v_batt l v uvlobatth v uvlobattl rdy hi - z l out1h/l h l fet_g h l ina h uvloin l v uvloinh v uvloinl rdy hi - z l out1h/l h l fet_g h l ina h vcc2 l v uvlo2h v uvlo2l rdy hi - z l out1h/l h l fet_g h l 19 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 (3) short circuit protection function (scp) when the scpin pin voltage exceeds v scdet , the scp function will be activated. when the scp function is activated, the out1 h/l pin voltage will be set to the hi - z/hi - z level and the proout pin voltage will go to the l level first (soft turn - off ). next, after t sto has passed, out1h/l pin becom e hi - z/l (proout pin hold l). in addition, when out2 pin voltage < v out2on , miller clamp function operates. when the rising edge is put in the ena pin, the scp function will be released. when out1h/l=hi - z/l or hi - z/hi - z, internal mosfet connected to scpin pin turns on to discharge c blank for desaturation protection function. when out1h/l=h/hi - z, internal mosfet connected to scpin pin turns off. v desat O 15 k k k 15 k k k 15 k k k 15 k k k 15 k k k 15 k k k 15 k k k 15 k k k 15 k k k 15 k k k 15 k k k 15 k k k 15 k k k ? ? ? ? ? ? desatleb cc scdet blank blank scdet cc f scdet desat t v v r r r r c r r r r r r s t r r r r v v v v r r r v v v min d ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ) 3 1 2 3 1 ln( 3 1 2 3 1 2 3 1 2 3 3 2 3 2 outernal 2 1 20 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 fig ure 35 . block diagram of short circuit protection fig ure 36 . block diagram of desat scpfil logic v scdet vcc2 out1h/l proout scpin gnd2 flt gnd1 vee2 flt + - r1 r2 r3 d1 scpfil logic v scdet vcc2 out1h/l proout scpin gnd2 flt gnd1 vee2 flt + - 21 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 figure 37 . scp operation timing chart hi - z l hi - z l scpmsk ? v scdet l hi - z h v vtlto h l flt proout scpin out1 h/l in hi - z l hi - z l v scdet l hi - z h h l t sto t scpfil t scpro ena l h > t enafil > t enafil t sto t scpfil t scpro figure 38 . scp operation status transition diagram v scpin >v scdet yes no start out1 h/l =hi - z / hi - z , proout=l, flt=l , out2=hiz out1 h/l =h / hi - z , proout=hi - z , out2 =hiz exceed filter time yes no ena=l h yes no in=h yes no no out1 h/l = hi - z / l, proout = l, out2=l yes flt=hi - z exceed t sto out2 23 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 figure 40 . t hermal protection function operation timing chart figure 4 1. t hermal protection function operation status transition diagram hi - z l hi - z l scpmsk ? v scdet l hi - z h v vtlto h l flt proout vtsin out1 h/l in hi - z l hi - z l v tsdet l hi - z h h l t sto t tsfil ena l h > t enafil > t enafil t sto t tsfil v tsin >v tsdet yes no start out1 h/l =hi - z / hi - z, proout=l , flt=l , out2=hiz out1 h/l =h / hi - z, proout=hi - z , out2=hiz exceed filter time yes no ena=l h yes no in=h yes no out2 25 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 (d) the pin handling when not using switching controller when not using switching controller, please do pin handling as follows. pin no. pin name processing method 21 rt pull down in gnd1 by 68k osfbfil is provided. fet_g sense gnd1 comp v_batt vreg rt fb + - comp osc slope s r q uvlo_batt ovp uvp maxduty vreg + - v fb osc softstart oc v fb f ig ure 43 . the pin handling when not using switching controller 26 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 (7) i/o condition table no. stat u s input output v b a t t v c c 2 s c p i n v t s i n e n a i n b i n a o u t 2 p r o o u t o u t 1 h o u t 1 l o u t 2 p r o o u t f l t r d y 1 scp : > uvlo, x:don't care 27 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 (8) power supply startup / shutoff sequence fig ure 44. power supply startup / shutoff sequence out1 h/l proout rdy v _batt vcc2 vee2 in h l h l hi - z l hi - z l hi - z v uvlo2h v uvlo batt l v uvlo2h v uvlo batt l v uvlo2h v uvlo batt l 0 v 0 v 0 v out2 l hi - z out1 h/l proout rdy v _batt vcc2 vee2 in h l h l hi - z l hi - z l hi - z v uvlo2h v uvlo batt l v uvlo2l v uvlo batt h v uv lo2l v uvlo batt h 0 v 0 v 0 v out2 l hi - z out1 h/l proout rdy v _batt vcc2 vee2 in h l h l hi - z l hi - z l hi - z v uvlo2h v uvlo batt l v uvlo2h v uvlo batt l v uvlo2l v uvlo batt h 0 v 0 v 0 v out2 l hi - z out1 h/l proout rdy v _batt vcc2 vee2 in h l h l hi - z l hi - z l hi - z v uvlo2l v uvlo batt h v uvlo2l v uvlo batt h v uvlo2l v uvlo batt h 0 v 0 v 0 v out2 l hi - z : since the vcc2 to vee2 pin voltage is low and the output mos does not turn on, the output pins become hi - z conditions. : since the vcc1 to gnd1 pin voltage is low and the rdy output mos does not turn on, the output pins become hi - z conditions. 28 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 selection of componen ts externally connecte d figure 45. recommended external parts power dissipatio n thermal design please make sure that the ic s chip temperature tj is not over 150 c , while considering the ic s power consumption (w), package power (pd) and ambient temperature (ta). when tj=150 c is exceeded, the ic may malfunctions or some problems (ex. abnormal operation of various parasitic elements and increasing of leak current) may occur. constant use under these circumstances leads to deterioration and eventually ic may destruct. tjmax=150 c must be strictly obeyed under all circumstances. figure 46. ssop - b28w derating curve measurement machine : th156 (kuwano ele ctric) measurement condition : rohm board board size : 114.3 76.2 1.6mm 3 1 - layer board : ja=111.1 c /w recommended rohm mcr03ezp recommended rohm mcr03ezp recommended sumida ceer117 recommended rohm rb168m150 recommended rohm ltr18ezp recommended rohm mcr100jzh ltr50uzp recommended rohm mcr100jzh ltr50uzp recommended rohm rsr025n05 0 0.25 0.5 0.75 1 1.25 1.5 0 25 50 75 100 125 150 175 ambient temperature : ta [ ] power dissiqation : pd [w] 29 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 i/o equivalence circuit s pin no. pin name input output equivalent circuit diagram pi n function 2 proout soft turn - off pin / gate voltage input pin 3 vtsin thermal detection pin 4 scpin schort circuit current detection pin 7 mode mode selection pin of output - side uvlo 8 uvloin output - side uvlo setting pin vcc2 vee2 gnd2 uvloin vcc2 mode vee2 gnd2 vcc2 vtsin gnd2 vcc2 proout vee2 vcc2 scpin gnd2 30 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 pin no. pin name input output equivalent circuit diagram pin function 11 out1h sour ce side output pin 12 out1l sink side output pin 13 out2 output pin for miller clamp 16 flt fault output pin 20 rdy ready output pin 17 ena input enabling signal pin out1l vee2 vcc2 out1h out2 vee2 vcc2 vreg gnd1 ena flt rdy gnd1 31 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 pin no. pin name input output equivalent circuit diagram pin function 18 ina control input pin a 19 inb control input pin b 21 rt switching frequency setting pin for switching controller 22 fb error amplifier inverting input pin for switching controller rt v_batt vee2 gnd1 fb v_batt internal power supply vr eg gnd1 inb vreg gnd1 ina 32 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 pin no. pin name input output equivalent circuit diagram pin function 23 comp error amplifier output pin for switching controller 25 vreg input - side internal power supply pin 26 fet_g mos fet control pin for switching controller 27 sense current detection pin fo r switching controller gnd1 comp internal power supply v_batt gnd1 fet_g vreg v_batt internal power supply v_batt gnd1 sense internal power supply 33 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 oper ational notes 1. r everse connection of power suppl y design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analo g blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when u sing electrolytic capacitors. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at th e reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum ratin g of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended opera ting conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special considerat ion to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should a lways be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin s hort and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 34 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 oper ational notes C continued 12. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, creat ing a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevit ably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower th an the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 4 7 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance w ith temperature and the decrease in nominal capacitance due to dc bias and others. o rdering informatio n b m 6 0 0 5 4 f v - c e 2 part number package fv: ssop - b 28w rank c:automotive packaging and forming sp ecification e2: embossed tape and reel marking diagra m ssop - b28w ( top view) b m 6 0 0 5 4 part number ma rking lot number 1pin mark n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s 35 / 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 p hysical dimension, tape and reel informatio n package name ssop - b28 w (max 9.55 (include.burr)) 36/ 36 b m60054fv - c tsz02201 - 0818abh00080 - 1 - 2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 revision history date revision changes 10 . apr .201 5 00 1 new release 25 .dec.2015 002 page 7 adding ul1577 rating table page15 misprint correction of description of pins and cautions on layout of board (7)flt page17 misprint correction of description of functions and examples of constant setting ( 1 ) miller clamp function notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties. datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. datasheet part number bm60054fv-c package ssop-b28w unit quantity 1500 minimum package quantity 1500 packing type taping constitution materials list inquiry rohs yes bm60054fv-c - web page |
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